以優異的產品品質提升東芯在存儲芯片行業中的競爭力，力爭做到行業的領頭者。秉承顧客至上的理念，傾聽顧客需求結合自身進行持續改善，提升客戶滿意度，制造高品質的綠色環保產品。
Dosilicon counts on excellent product quality to enhance the competitiveness in the memory chip industry, and strives to be the leader of the industry. Adhering to the concept of customer first, we listen to customer needs to carry out constant improvement, improve customer satisfaction, and manufacture high-quality environment-friendly products.
東芯堅信不積跬步，無以至千里。只有各部門踏實的做好每一步的工作，認真負責才能制造出高品質高可靠性的綠色環保產品。因此無論是對內抑或對合作伙伴，東芯都堅持嚴要求，高標準。
Dosilicon firmly believes that small steps get us to faraway places. Only when all departments of the company make great efforts and be responsible can environment-friendly products of high quality and reliability be manufactured. Therefore, we Dosilicon sticks to strict requirements and high standards while dealing with both internal and cooperation partners.
東芯秉持制造“0缺陷”，滿足客戶需求的高品質產品。這主要基于東芯完善的質量管理系統，其中對各個部門及工序均有標準，完整的流程。為了持續提升客戶滿意度，針對客戶的各種需求，東芯有一套詳細的評審實施流程來管理評估各個客戶的各種需求。滿足客戶需求的同時，針對客戶反饋的異常，東芯也有嚴格的MRB處理流程等，如果有需要東芯還能提供SEM、EDX、FIB、FTIR等先進的FA失效分析手段，可以精確定位失效模式，從而進行研究分析。在產品生產階段，東芯有完善的SPC監控、良率監控等程序來對制程數據進行實時監控，并通過定期的評審進行持續改善。為了不影響客戶對產品的使用，在產品變更過程中東芯有標準的產品變更通知流程對可能影響功能性、可靠性等方面的變更進行評估驗證并通知客戶。除此之外還很多其他標準的流程，機制和系統等來保障高品質產品的誕生。
Dosilicon upholds the principle of "zero defect" in manufacturing quality products to meet the customer needs. This is mainly based on the sound quality management system, which incorporates standardized and complete procedures for each department and process. Aiming at continuously improving customer satisfaction, Dosilicon has a set of detailed review process to manage and evaluate various customer needs. While meeting the customer needs, it also has a strict MRB procedure to handle customers’ complaints. If needed, advanced FA failure analysis methods such as SEM, EDX, FIB and FTIR can be provided to accurately locate the failure mode for research and analysis. During the production, there are sound SPC monitoring, yield monitoring and other procedures to monitor the process data in real time. Continuous improvement is achieved through regular review. During the product change process, to avoid affecting customers’ use of our products, there is a standard product change notification procedure to evaluate and verify the changes that may affect the functionality and reliability, and customers will be informed. In addition, there are many other standardized procedures, mechanisms and systems supporting the production of quality products.
東芯對于合作伙伴的選擇、認證、管理，有這一套完整且嚴格的流程和標準。
Dosilicon has a set of complete and rigorous procedures and standards for the selection, verification and management of partners.
選擇的合作伙伴均是業界Top供應商，有豐富的生產制造經驗，且有長期的戰略合作伙伴。其還通過了ISO9001/IATF16949/ISO14001/ISO45001/ESD20.20等專業認證。
All the selected partners are Tier 1 suppliers in the industry. They have rich manufacturing experience and long-term strategic cooperative relations. They have also passed ISO9001 / IATF 16949 / ISO14001 / ISO 45001 / ESD 20.20 and other professional certifications.
高品質的產品不僅體現在質量高、環保。高可靠性也是其必不可少的重要指標。
High-quality products are not only of high quality and environmental-friendly, but also of high reliability.
質量是產品現階段的品質評判標準，可靠性是產品長期使用過程中品質的評判標準。
High quality is the quality evaluation standard at the present stage, while reliability in the long-term use of products.
東芯在新產品設計、認證、量產階段都會進行可靠性測試同時還會進行晶圓級可靠性測試。所有的可靠性均遵循JEDEC,AEC-Q100國際通用標準進行。
In the new product design, certification, mass production stage, Dosilicon will carry out reliability testing and the wafer level reliability testing. All the reliability tests are performed in accordance with international standards of JEDEC, AEC-Q100.
東芯半導體股份有限公司，致力于成為中國領先的存儲芯片設計企業。一直將節能環保作為貫穿整個芯片設計生產的目標，同時我們針對有害物質建立管理及檢查機制。從物料源頭到產品生產，完全符合所有有害物質的管制要求，且生產過程所使用的各種化學品也符合標準原則。我們所生產的產品符合歐盟電機電子產品中有害物質限用指令(RoHS 2.0 (2011/65/EU)。對RoHS 2.0中限制產品使用的十種限用物質(鉛Pb、汞Hg、鎘Cd、六價鉻Cr6+、聚溴聯苯PBBs、聚溴二苯醚PBDEs、四項塑化劑鄰苯二甲酸酯(DEHP、BBP、DBP、DIBP))不得超過最大濃度。并提供均質材料的第三方檢測報告作為符合依據。同時我們遵守政府環保與安全衛生法令要求，詳實調查供應鏈中的金(Au)、鉭(Ta)、鎢(W)、錫(Sn)、鈷(Co)這類沖突金屬并非來自剛果民主共和國(DRC)，及其周邊盧旺達(Rwanda)、烏干達(Uganda)、布隆迪(Burundi)、坦桑尼亞(Tanzania)、肯尼亞(Kenya)等沖突地區的礦區。
Dosilicon is committed to becoming China's leading memory design enterprise. Energy saving and environmental protection have always remained at the core of our vision throughout the whole chip design and production. We also have established a management and inspection mechanism for hazardous substances. From material sources to product production, we have conformed to all the control requirements of hazardous substances, and all chemicals used in the production process are also in line with the standard principles. Our products comply with the RoHS II---Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (2011 / 65 / EU). The ten substances (Pb, Hg, CD, Cr6+, PBBs, PBDEs, and the four Plasticizer phthalate including DEHP, BBP, DBP, DIBP) restricted in RoHS II will not exceed the maximum concentration. The third-party test report of homogeneous materials is provided as the proof. In addition, we comply with the requirements of the government's environmental protection and safety and health decree, and have detailed investigations on conflict metals such as Au, Ta, W, Sn and Co in the supply chain, making sure that these metals are not from conflict mining areas in the Democratic Republic of Congo (DRC) and its surrounding Rwanda, Uganda, Burundi, Tanzania, Kenya, etc.
如果您有任何疑問或需要其他信息，請與我們聯系。
For any question or inquiry about other information, please contact us.