SPI NAND Flash

單芯片設計的串行通信方案，引腳少、封裝尺寸小，且在同一顆粒上集成了存儲陣列和控制器，并帶有內部ECC模塊，使其在滿足數據傳輸效率的同時，既節約了空間，又提升了穩定性。產品現擁有38nm及2xnm的成熟工藝制程，目前工藝制程已經推進至1xnm先進工藝制程。產品可提供3.3V /1.8V兩種電壓，具備WSON、BGA多種封裝形式，不僅能滿足常規應用場景，也使其在目前日益普及的由電池驅動的移動互聯網及物聯網設備中保持低功耗，有效延長設備的待機時間，也更靈活地適用于不同應用場景。

Dosilicon's SPI NAND Flash is a serial peripheral interface SLC NAND Flash which the memory array and controller are integrated on one cell, with an internal ECC module. It not only offers satisfactory data transmission efficiency, but also saves space and enhances stability. It now incorporates 38 nm and 2x nm process technology.At present, the process has been advanced to 1xnm process.SPI NAND Flash is suitable for two voltages, and comprises several packages, which are applicable to varied application scenarios.